Imaging device, method of producing imaging device, imaging apparatus, and electronic apparatus

ABSTRACT

Provided is an imaging device that enables formation of a film over the entirety of a film formation region, a method of producing the imaging device, an imaging apparatus, and an electronic apparatus. The imaging device includes a sensor and a glass sheet bonded to a front surface of the sensor. The glass sheet is provided with a recess in a peripheral portion thereof that is outside a film formation region thereof over which an inorganic film is to be formed. The recess corresponds to a claw provided on a periphery of an opening of a tray for a vapor deposition process for the inorganic film. This allows the entirety of the film formation region of the glass sheet to be exposed from the opening when the imaging device is set in the opening, and thus enables formation of the inorganic film over the entirety of the film formation region.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of U.S. patentapplication Ser. No. 16/643,959, filed on Mar. 3, 2020, which is a U.S.National Phase of International Patent Application No. PCT/JP2018/031870filed on Aug. 29, 2018, which claims priority benefit of Japanese PatentApplication No. JP 2017-174899 filed in the Japan Patent Office on Sep.12, 2017. Each of the above-referenced applications is herebyincorporated herein by reference in its entirety.

TECHNICAL FIELD

The present disclosure relates to an imaging device, a method ofproducing an imaging device, an imaging apparatus, and an electronicapparatus. In particular, the present disclosure relates to an imagingdevice that enables formation of an inorganic film over the entirety ofa film formation region of a flat surface of a singulated glass sheettherein and a method of producing the imaging device. The presentdisclosure also relates to an imaging apparatus and an electronicapparatus.

BACKGROUND ART

Imaging devices have been proposed that each suppress degradation ofoptical performance thereof by keeping light from an oblique directionfrom entering the imaging device with an inorganic film such as an AR(Anti Reflection) film and an IRCF (Infra-Red Cut Filter) film formed ona glass sheet of the imaging device (see PTL 1 and PTL 2).

CITATION LIST Patent Literature

PTL 1: Japanese Unexamined Patent Application Publication No.2015-170638

PTL 2: Japanese Unexamined Patent Application Publication No.2015-012474

SUMMARY OF THE INVENTION Problems to be Solved by the Invention

Be aware that according to the technique for producing imaging devicesdisclosed in PTL 1 and PTL 2, an inorganic film such as an AR (AntiReflection) film and an IRCF (Infra-Red Cut Filter) film is formed atonce on glass sheets of the imaging devices while a plurality ofsingulated imaging device chips is accommodated in a chip tray.

The chip tray is provided with a plurality of openings havingsubstantially the same size as the singulated imaging device chips. Eachof the openings is provided with an inward claw and receives a glasssheet of an imaging device being fitted into the opening such that theclaw thereof abuts a peripheral portion of the glass sheet whileexposing the glass sheet from the opening. The film formation isperformed on the glass sheets fixed in such a state.

However, the claws fixing the glass sheets each shade a portion of thecorresponding glass sheet, creating a non-film region under or aroundthe claw, in which the film formation is not feasible.

Accordingly, a possible way to form a film over the entirety of a filmformation region over which the film is to be formed is reducing a sizeof the claws that fix the imaging device chips in consideration of thenon-film region.

However, although reducing the size of the claws that fix the imagingdevice chips makes it possible to form a film over the film formationregion, the claws having the reduced size can allow the imaging devicechips to fall off the tray unless each of the imaging device chips andthe corresponding opening are aligned accurately.

The present disclosure has been achieved in view of the above-describedcircumstances particularly to enable formation of an inorganic film overthe entirety of the film formation region of a flat surface of a glasssheet in a singulated imaging device.

Means for Solving the Problems

An imaging device according to an aspect of the present disclosureincludes an image sensor that captures an image and a glass sheetdisposed on the image sensor. The glass sheet has a peripheral portionprovided with a recess.

The peripheral portion provided with the recess may be located outside afilm formation region of the glass sheet. The film formation region maybe a region over which an inorganic film is to be formed.

The recess may be in a shape corresponding to a claw on a periphery ofan opening provided in a tray for formation of an inorganic film on theglass sheet.

The recess may be in a step-like shape.

The recess may be tapered and be in a flat surface shape.The recess may be in a curved surface shape.The recess may have a surface provided with a light-absorbing blackresin section.An inorganic film may be formed on the glass sheet.The inorganic film may be an AR (Anti Reflection) film or an IRCF(Infra-Red Cut Filter) film.

An imaging apparatus according to an aspect of the present disclosureincludes an image sensor that captures an image and a glass sheetdisposed on the image sensor. The glass sheet has a peripheral portionprovided with a recess.

An electronic apparatus according to an aspect of the present disclosureincludes an image sensor that captures an image and a glass sheetdisposed on the image sensor. The glass sheet has a peripheral portionprovided with a recess.

A method of producing an imaging device according to an aspect of thepresent disclosure includes a first step and a second step. The imagingdevice includes an image sensor that captures an image and a glass sheetdisposed on the image sensor. The glass sheet has a peripheral portionprovided with a recess. In the first step, first grooves are formed inan undiced imaging device along central lines of dicing lines usingfirst blades having a predetermined width. In the second step, theundiced imaging device is diced along the central lines of the dicinglines using second blades having a width smaller than the predeterminedwidth.

The first blades may be V-shaped blades.

The method may further include a third step, a fourth step, and a fifthstep. In the third step, second grooves are formed in the undicedimaging device along the central lines of the dicing lines using thirdblades after the first step. The second grooves have a depth larger thanthe first grooves. The third blades have a width smaller than thepredetermined width of the first blades and larger than the width of thesecond blades. In the fourth step, the second grooves are filled with ablack resin. In the fifth step, third grooves are formed in the undicedimaging device along the central lines of the dicing lines using fourthblades. The third grooves have a depth smaller than the first grooves.The fourth blades have a width smaller than the predetermined width ofthe first blades and larger than the width of the third blades. Afterthe fifth step, the second step may be performed to dice the undicedimaging device along the central lines of the dicing lines using thesecond blades.

The first blades and the fourth blades may be the same V-shaped blades,and the first blades and the fourth blades may be different in depth ofgrooves to form.

The method may further include a sixth step of forming an inorganic filmon the glass sheet after the second step.

The inorganic film may be an AR (Anti Reflection) film or an IRCF(Infra-Red Cut Filter) film.

An aspect of the present disclosure includes an image sensor thatcaptures an image and a glass sheet disposed on the image sensor. Theglass sheet has a peripheral portion provided with a recess.

Effects of the Invention

According to an aspect of the present disclosure, it is particularlypossible to form an inorganic film over the entirety of a film formationregion of a flat surface of a glass sheet in a singulated imagingdevice.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a diagram explaining a method of forming an inorganic film ona glass sheet of an imaging device.

FIG. 2 is a diagram explaining a method of forming an inorganic filmover the entirety of a film formation region of the glass sheet of theimaging device.

FIG. 3 is a diagram explaining a configuration example of a firstembodiment of the imaging device according to the present disclosure.

FIG. 4 is a diagram explaining a method of producing the imaging devicein FIG. 3.

FIG. 5 is a diagram explaining a configuration example of a secondembodiment of the imaging device according to the present disclosure.

FIG. 6 is a diagram explaining a method of producing the imaging devicein FIG. 5.

FIG. 7 is a diagram explaining occurrence of ghost and flare in theimage device.

FIG. 8 is a diagram explaining a configuration example of a thirdembodiment of the imaging device according to the present disclosure.

FIG. 9 is a diagram explaining a method of producing the imaging devicein FIG. 8.

FIG. 10 is a diagram explaining a configuration example of a fourthembodiment of the imaging device according to the present disclosure.

FIG. 11 is a diagram explaining a method of producing the imaging devicein FIG. 10.

FIG. 12 is a block diagram illustrating a configuration example of animaging apparatus being an electronic apparatus to which the imagingdevice according to the present disclosure has been applied.

FIG. 13 is a diagram explaining usage examples of an imaging device towhich a technique of the present disclosure has been applied.

FIG. 14 is a view depicting an example of a schematic configuration ofan endoscopic surgery system.

FIG. 15 is a block diagram depicting an example of a functionalconfiguration of a camera head and a camera control unit (CCU).

FIG. 16 is a block diagram depicting an example of schematicconfiguration of a vehicle control system.

FIG. 17 is a diagram of assistance in explaining an example ofinstallation positions of an outside-vehicle information detectingsection and an imaging section.

FIGS. 18A, 18B, and 18C are diagrams illustrating an overview ofconfiguration examples of a stacked solid-state imaging apparatus towhich the technique according to the present disclosure is applicable.

FIG. 19 is a cross-sectional view illustrating a first configurationexample of a stacked solid-state imaging apparatus 23020.

FIG. 20 is a cross-sectional view illustrating a second configurationexample of the stacked solid-state imaging apparatus 23020.

FIG. 21 is a cross-sectional view illustrating a third configurationexample of the stacked solid-state imaging apparatus 23020.

FIG. 22 is a cross-sectional view illustrating another configurationexample of the stacked solid-state imaging apparatus to which thetechnique according to the present disclosure is applicable.

MODES FOR CARRYING OUT THE INVENTION

The following describes preferred embodiments of the present disclosurein detail with reference to the accompanying drawings. It should benoted that in this specification and the drawings, constituent elementsthat have substantially the same functional configuration are indicatedby the same reference signs, and thus redundant description thereof isomitted.

The following describes modes (referred to below as embodiments) forcarrying out the present disclosure. It should be noted that thedescription is given in the following order.

1. Inorganic Film Formation Method 2. First Embodiment 3. SecondEmbodiment 4. Third Embodiment 5. Fourth Embodiment 6. Example ofApplication to Electronic Apparatus 7. Usage Examples of Imaging Device8. Example of Application to Endoscopic Surgery System 9. Example ofApplication to Mobile Body

10. Configuration Examples of Stacked Solid-state Imaging apparatus towhich Technique according to Present Disclosure is Applicable

1. INORGANIC FILM FORMATION METHOD

An imaging device according to the present disclosure enables formationof an inorganic film over the entirety of a film formation region of asingulated glass sheet. For description of the imaging device accordingto the present disclosure, a method of forming an inorganic film on asingulated glass sheet will be described.

An upper left part of FIG. 1 illustrates a configuration example of asingulated imaging device (also referred to as a solid-state imagingapparatus) 11. The imaging device 11 has a three-layer structureincluding a glass sheet 31, a resin layer 32, and a sensor section 33 inorder from top to bottom of FIG. 1. The resin layer 32 for exampleincludes a transparent resin and bonds the sensor section 33 and theglass sheet 31 together.

An AR (Anti Reflection) film 41 being an inorganic film is formed on asurface F1, which is an upper surface in FIG. 1, of the glass sheet 31illustrated in the upper left part of FIG. 1.

More specifically, as illustrated in a lower left part of FIG. 1, a tray51 is provided with arrayed quadrilateral openings 61 each havingsubstantially the same size as the imaging device 11. A singulatedimaging device 11 is fixed in each of the openings 61 with the glasssheet 31 facing downward in the paper sheet of FIG. 1. The AR film 41being an inorganic film is formed on the surface F1 of the glass sheet31 exposed from the opening 61 through vapor deposition as illustratedin an upper right part of FIG. 1.

That is, as illustrated in the upper right part of FIG. 1 and anenlarged view ex1 in a lower right part of FIG. 1, each of the openings61 is provided with a claw 62 on a periphery thereof, and the claw 62abuts the glass sheet 31 of the corresponding imaging device 11 at aperipheral portion of the surface F1 to fix the surface F1 of the glasssheet 31 with the surface F1 exposed from the opening 61. As a result,the AR film 41 being an inorganic film is formed through vapordeposition on the surface F1 of the glass sheet 31 fixed while beingexposed from the opening 61. It should be noted that arrows in FIG. 1represent the vapor deposition through which the AR film 41 is formed.

Be aware that each of the claws 62 protrudes onto the surface F1 of thecorresponding glass sheet 31. When the AR film 41 being an inorganicfilm is formed as illustrated in FIG. 1, therefore, the claw 62 islikely to create a non-film region in a portion of a film formationregion that is located in the peripheral portion of the glass sheet 31,as illustrated in an upper part of FIG. 2.

An upper left part of FIG. 2 illustrates a configuration correspondingto the upper right part of FIG. 1. Furthermore, an enlarged view ex11 ofa rectangular portion in an upper right part of FIG. 2 is an enlargedview of a rectangular portion in the upper left part of FIG. 2. Aportion of the glass sheet 31 that is located on the left side of adotted line in FIG. 2 is the film formation region. However, asindicated by a range Z1 in the enlarged view ex11, the claw 62protruding onto the glass sheet 31 produces shade, preventing the ARfilm 41 being an inorganic film from being formed over the entirety ofthe film formation region whose boundary is indicated by dotted lines.That is, as indicated by the range Z1 in the enlarged view ex11, thefilm formation method described with reference to FIG. 1 can leave aregion in which formation of the AR film 41 being an inorganic film hasbeen unsuccessful in a portion of the film formation region of the glasssheet 31.

A possible way to solve such an issue is reducing a length of the claw62 in the upper left part of FIG. 2 to a length of a claw 62′ in amiddle part of FIG. 2 to increase a width of the opening 61 from a widthW1 illustrated in the upper part of FIG. 2 to a width W11 illustrated inthe middle part of FIG. 2, so that the AR film 41 is able to be formedover the entirety of the film formation region indicated by the dottedlines including an end portion thereof as illustrated in an enlargedview ex12 in a middle right part of FIG. 2.

However, as a result of the claw 62 being replaced with the claw 62′ andthe width of the opening 61 being changed from the width W1 to the widthW11 as illustrated in the middle part of FIG. 2 to enable formation ofthe AR film 41 over the entirety of the film formation region, an areaof abutment of the claw 62′ against the peripheral portion of the glasssheet 31 becomes smaller. Even a slight misalignment of the glass sheet31 relative to the opening 61, for example, can therefore cause theimaging device 11 to fall off the tray 51 from the opening 61 due to theclaw 62′ failing to abut the peripheral portion of the glass sheet 31 asillustrated in a lower right part of FIG. 2.

2. FIRST EMBODIMENT»

The imaging device according to the present disclosure is thereforeprovided, on an outer periphery of the film formation region, with arecess to be abutted by a claw on an outer periphery of an openingprovided in a tray, so that the entirety of the film formation region isexposed from the opening and an inorganic film is able to be formed overthe entirety of the exposed film formation region through a vapordeposition process.

FIG. 3 illustrates a configuration example of a first embodiment of theimaging device according to the present disclosure that enablesformation of an inorganic film over the entirety of the film formationregion.

As illustrated in an upper part of FIG. 3, an imaging device 101includes a glass sheet 131, a resin layer 132, and a sensor section 133in order from top to bottom of FIG. 3, and the resin layer 132, which istransparent, bonds the glass sheet 131 and the sensor section 133together. The sensor section 133 includes, for example, a CMOS(Complementary Metal Oxide Semiconductor) image sensor. The sensorsection 133 generates an image from light entering from a subjectthrough the glass sheet 131 and the resin layer 132, and outputs theimage.

Furthermore, the top of the glass sheet 131 in FIG. 3 is a surface F101including the film formation region over which an AR film 141 (lowerpart of FIG. 3) being an inorganic film is to be formed. A recess 111 isprovided in a periphery of the surface F101. As illustrated in the lowerpart of FIG. 3, the recess 111 is in a step-like shape to be abutted bya claw 162 provided around an opening 161 provided in a tray 151corresponding to the tray 51 in FIG. 1. As illustrated in the upper partof FIG. 3, the recess 111 is formed as a surface one step lower than areference surface, which in FIG. 3 is the surface F101, and a leveldifference therebetween is substantially the same as a height of theclaw 162.

Such a configuration exposes the surface F101 from the opening 161 asillustrated in an enlarged view ex31 of a rectangular region in a lowerleft part of FIG. 3. The AR film 141 including an inorganic film istherefore formed to cover an end portion of the surface F101 includingthe film formation region located on the left side of a dotted line.Thus, it is possible to suppress creation of a non-film region, andreduce occurrence of ghost and flare due to light that can enter throughthe non-film region.

Furthermore, the surface F101 including the film formation region of theglass sheet 131 is described as having substantially the same shape andsubstantially the same size as the opening 161. To be exact, the surfaceF101 is slightly smaller than the opening 161 and protrudes frontwardfrom the recess 111 when viewed from an image plane of the sensorsection 133. The imaging device 101 is therefore to be fixed such thatthe surface F101 of the glass sheet 131 is fitted into the opening 161and the recess 111 is abutted by the claw 162. Since the entirety of thesurface F101 including the film formation region of the glass sheet 131is thus exposed from the opening 161, it is possible to form the AR film141 over the entirety of the surface F101 through a vapor depositionprocess and keep the imaging device 101 from falling off from theopening 161.

<Method of Producing Imaging Device in FIG. 3>

The following describes a method of producing the imaging device in FIG.3 with reference to FIG. 4.

In a first step, the sensor section 133 prior to singulation for theimaging device 101 is attached to a dicing sheet 181 with the glasssheet 131 facing upward as illustrated in an uppermost portion of a leftpart of FIG. 4.

In a second step, as illustrated in a second portion from the top of theleft part of FIG. 4, blades 201 are fixed such that a location of acentral line of each of the blades 201 coincides with a location of acentral line of a corresponding one of dicing lines for the singulatedimaging device 101 and a distance between inner surfaces of the blades201 is equal to a width of the film formation region. Subsequently, theblades 201 in such a state are then used to form grooves 131 a in theglass sheet 31 (see a third portion from the top of the left part ofFIG. 4).

In a third step, as illustrated in the third portion from the top of theleft part of FIG. 4, the blades 201 are pulled out, and then blades 211are positioned such that a location of a central line of each of theblades 211 coincides with the location of the central line of acorresponding one of the dicing lines for the singulated imaging device101. The blades 211 in such a state are used to cut (dice) the glasssheet 131, the resin layer 132, the sensor section 133, and the dicingsheet 181.

In a fourth step, the blades 211 are pulled out, thereby yielding thesingulated imaging device 101 as illustrated in a lowermost portion ofthe left part of FIG. 4.

That is, as a result of the singulated imaging device 101 being yieldedby cutting the grooves 131 a along central lines thereof using theblades 211, opposite end portions of the grooves 131 a are formed to bethe recess 111 in an end portion of the glass sheet 31 of the imagingdevice 101.

Thus, of the glass sheet 31, a range excluding the recess 111 is formedas the surface F101 including the film formation region. The surfaceF101 has substantially the same shape and substantially the same size asthe opening 161 of the tray 151. To be exact, the surface F101 isslightly smaller than the opening 161.

In a fifth step, as illustrated in an upper right part of FIG. 4, theimaging device 101 is turned upside-down and placed such that the recess111 is abutted by the claw 162. The vapor deposition process isperformed from below in FIG. 4 on the surface F101 being the filmformation region exposed from the opening 161, and thus the AR film 141being an inorganic film is able to be formed over the entirety of thesurface F101 being the film formation region.

It should be noted that the blades 201 and 211 are dicing blades. Alateral width of the recess 111 may be adjusted by setting a width ofthe blades 201 to a value approximately six to ten times a width of theblades 211 for the singulation.

Furthermore, any film other than the AR film 141 may be formed on thesurface F101 including the film formation region as long as the film isan inorganic film. For example, an IRCF (Infra-Red Cut Filter) film maybe formed.

3. SECOND EMBODIMENT»

Through the above, an example of the imaging device 101 has beendescribed that includes the recess 111 formed in the periphery of thesurface F101 including the film formation region of the glass sheet 31.According to this configuration, the recess 111 is abutted by the claw162 of the tray 151, and the surface F101 including the film formationregion of the glass sheet 31 is exposed from the opening 161, enablingformation of an inorganic film over the entirety of the surface F101including the film formation region. However, the claw 162 may betapered, and the recess 111 may accordingly be tapered, as long as aconfiguration that allows the surface F101 including the film formationregion of the glass sheet 31 to be exposed from the opening 161 isachieved.

A left part of FIG. 5 illustrates a configuration example of a secondembodiment of the imaging device according to the present disclosureprovided with a recess, which replaces the recess 111, to be abutted bya tapered claw, which replaces the claw 162. It should be noted thatconstituent elements in FIG. 5 corresponding to the constituent elementsin FIG. 3 are indicated by the same reference signs as in FIG. 3, anddescription thereof is omitted as appropriate.

The configuration of the imaging device 101 in the left part of FIG. 5is different from the configuration in FIG. 3 in that a tapered recess111′ is provided instead of the recess 111 of the glass sheet 31.Furthermore, a tapered claw 162′ that matches the taper of the recess111′ is provided instead of the claw 162 of the tray 151.

That is, in this configuration, the surface F101 including the filmformation region protrudes frontward from the recess 111′ when viewedfrom the image plane of the sensor section 133. Furthermore, an angle ofthe taper of the claw 162′ and an angle of the taper of the recess 111′correspond to each other. The claw 162′ abuts the recess 111′ with thesurface F101 including the film formation region exposed from an opening161′. The AR film 141 being an inorganic film is formed on the exposedsurface F101 including the film formation region as indicated by a rangeZ51 in an enlarged view ex51 of a rectangular range of the left part ofFIG. 5.

As a result, it is possible to form the AR film 141 including aninorganic film over the entirety of the surface F101 including the filmformation region.

Furthermore, a width W31 of the opening 161′ is wider than the surfaceF101 including the film formation region as illustrated in the left partof FIG. 5. It is therefore possible to form, by the above-describedconfiguration, the AR film 141 being an inorganic film also on therecess 111′ of the glass sheet 31 over a region that is not abutted bythe claw 162′ as particularly indicated by a range Z52 in an enlargedview ex52 in a right part of FIG. 5. This configuration enablessuppression of entry of reflected light not only from the surface F101including the film formation region but also from directions of sidesurfaces adjacent to the surface F101, reducing occurrence of ghost andflare.

<Method of Producing Imaging Device in FIG. 5>

The following describes a method of producing the imaging device 101 inFIG. 5 with reference to FIG. 6.

In a first step, the sensor section 133 prior to singulation for theimaging device 101 is attached to the dicing sheet 181 with the glasssheet 131 facing upward as illustrated in an uppermost portion of FIG.6.

In a second step, as illustrated in a second portion from the top ofFIG. 6, a location of a central line of each of V-shaped blades 231 ismade to coincide with a location of a central line of a correspondingone of dicing lines for the singulated imaging device 101 and a distancebetween inner surfaces of the V-shaped blades 231 is made equal to thewidth of the film formation region. The blades 231 in such a state arethen used to form grooves 131 b (see a third portion from the top ofFIG. 6) in the glass sheet 131.

In a third step, as illustrated in the third portion from the top ofFIG. 6, blades 241 are positioned such that a location of a central lineof each of the blades 241 coincides with the location of the centralline of a corresponding one of the dicing lines for the singulatedimaging device 101. The blades 241 in such a state are then used to cut(dice) the glass sheet 131, the resin layer 132, the sensor section 133,and the dicing sheet 181.

In a fourth step, the blades 241 are pulled out, thereby yielding thesingulated imaging device 101 as illustrated in a lowermost portion ofFIG. 6.

That is, as a result of the singulated imaging device 101 being yieldedby cutting the grooves 131 b along central lines thereof using theblades 241, opposite end portions of the grooves 131 b are formed to bethe tapered recess 111′ in the end portion of the glass sheet 131 of theimaging device 101.

Thus, of the glass sheet 31, a range excluding the recess 111′ is formedas the surface F101 including the film formation region. The surfaceF101 has substantially the same shape and substantially the same size asthe opening 161 of the tray 151. To be exact, the surface F101 isslightly smaller than the opening 161.

In a fifth step, as illustrated in the left part of FIG. 5, the imagingdevice 101 is turned upside-down and placed such that the recess 111′ isabutted by the corresponding tapered claw 162′. The vapor depositionprocess is performed from below in FIG. 5 on the surface F101 being thefilm formation region exposed from the opening 161, and thus the AR film141 being an inorganic film is able to be formed over the entirety ofthe surface F101 being the film formation region.

Furthermore, as indicated by the range Z52 in the enlarged view ex52 ofthe right part of FIG. 5, the above-described configuration allows theAR film 141 to be formed also on the recess 111′ over a partial regionthat is not abutted by the claw 162′ through the above-described vapordeposition process. This enables reduction of occurrence of ghost andflare due to entry of light from an oblique direction, such as reflectedlight.

That is, since the recess 111 in the first embodiment or the recess 111′in the second embodiment is provided in the peripheral portion of theglass sheet 131 to correspond to the claw 162 or 162′ provided on theperiphery of the opening 161 of the tray 151, the surface F101 includingthe film formation region is exposed from the opening 161 or 161′, andan inorganic film is formed over the entirety of the surface F101.

In other words, a similar effect is produced as long as a recesscorresponding to the claw of the opening of the tray is provided in theperipheral portion of the glass sheet 131. Therefore, the shape of therecess that is provided in the peripheral portion of the glass sheet 131is not limited to those of the recess 111 (step-like shape) and therecess 111′ (flat surface shape). In addition to the step-like shape andthe flat surface shape, any shape such as a curved surface shape and afree-form curved surface shape is possible as long as edges of theperipheral portion of the glass sheet 131 are recessed or ground offinto a shape corresponding to the claw of the opening of the tray.

4. THIRD EMBODIMENT

Through the above, the imaging device 101 has been described thatenables formation of the AR film 141 being an inorganic film over theentirety of the surface F101 including the film formation region of theglass sheet 31. Additionally, the imaging device 101 may be enabled toreduce occurrence of ghost and flare due to a factor such as reflectedlight and multiply reflected light.

That is, for example, in a case where the imaging device 101 includingthe glass sheet 131, the resin layer 132, and the sensor section 133 isdisposed on a substrate 301 as illustrated in a left part of FIG. 7,incoming light, which is indicated by a ray trajectory L1, that hasentered the glass sheet 131 and the resin layer 132 can enter the sensorsection 133 after being reflected by a surface of the sensor section 133and end portions of the glass sheet 131 and the resin layer 132 to causeghost and flare.

Furthermore, likewise, incoming light indicated by a ray trajectory L11in a right part of FIG. 7 can be reflected by a circuit 311 provided onthe substrate 301, and the reflected light can enter the sensor section133 from the side surfaces. Also, incoming light indicated by a raytrajectory L12 can be reflected by the circuit 311 and a surface of theglass sheet 131, and the reflected light can enter the sensor section133. Such reflected light can cause ghost and flare.

A light-absorbing black resin section may therefore be formed on ends ofthe glass sheet 131 to suppress entry of light from the side surfaces,and thus reduce occurrence of ghost and flare due to reflected light andmultiply reflected light.

FIG. 8 illustrates a configuration example of a third embodiment of theimaging device 101 enabled to reduce occurrence of ghost and flare dueto reflected light and multiply reflected light by suppressing entry oflight from the side surfaces with the light-absorbing black resinsection formed on the ends of the glass sheet 131. It should be notedthat constituent elements of the imaging device 101 in FIG. 8 that havethe same functions as the constituent elements of the imaging device 101in FIG. 3 are indicated by the same reference signs as in FIG. 3, anddescription thereof is omitted as appropriate.

That is, the imaging device 101 in FIG. 8 is different from the imagingdevice 101 in FIG. 3 in that a light-absorbing black resin section 321is formed on an abutment surface of the recess 111, which is to beabutted by the claw 162 of the tray 151.

Such a configuration enables the imaging device 101 to reduce occurrenceof ghost and flare, because the black resin section 321 absorbs incominglight and reflected light entering from directions of the side surfacesof the glass sheet 131 of the imaging device 101.

<Method of Producing Imaging Device in FIG. 8>

The following describes a method of producing the imaging device 101 inFIG. 8 with reference to FIG. 9.

In a first step, the sensor section 133 prior to singulation for theimaging device 101 is attached to the dicing sheet 181 with the glasssheet 131 facing upward as illustrated in an uppermost portion of a leftpart of FIG. 9.

In a second step, as illustrated in a second portion from the top of theleft part of FIG. 9, a location of a central line of each of blades 331is made to coincide with a location of a central line of a correspondingone of dicing lines for the singulated imaging device 101 and a distancebetween inner surfaces of the blades 331 is made equal to the width ofthe film formation region. The blades 331 in such a state are then usedto form grooves 131 c (see a third portion from the top of the left partof FIG. 9) in the glass sheet 131.

In a third step, as illustrated in the third portion from the top of theleft part of FIG. 9, blades 341 are positioned such that a location of acentral line of each of the blades 341 coincides with the location ofthe central line of a corresponding one of the dicing lines for thesingulated imaging device 101. The blades 341 in such a state are thenused to form grooves 131 d (see a fourth portion from the top of theleft part of FIG. 11) having a depth extending from an inside of theglass sheet 131 through the resin layer 132 to an inside of the sensorsection 133.

In a fourth step, as illustrated in a fourth portion from the top of theleft part of FIG. 9, the blades 341 are pulled out, forming grooves 351,each of which is a combination of the groove 131 c and the groove 131 d.

In a fifth step, as illustrated in a lowermost portion of the left partof FIG. 9, the grooves 351 are filled with a black resin 371.

In a sixth step, as illustrated in an uppermost portion of a right partof FIG. 9, blades 381 having a width smaller than the grooves 131 c,which in other words is a width smaller than the blades 331, are used toform grooves 131 e (see a second portion from the top of the right partof FIG. 9) having a smaller width and a smaller depth than the grooves131 c in the black resin 371.

In a seventh step, as illustrated in the second portion from the top ofthe right part of FIG. 9, blades 391 having a smaller width than theblades 341 are positioned such that a location of a central line of eachof the blades 391 coincides with the location of the central line of acorresponding one of the dicing lines for the singulated imaging device101. The blades 391 in such a state are then used to cut (dice) theglass sheet 131, the resin layer 132, the sensor section 133, and thedicing sheet 181.

In an eighth step, the blades 391 are pulled out, thereby yielding thesingulated imaging device 101 as illustrated in a third portion from thetop of the right part of FIG. 9.

As a result of the singulated imaging device 101 being yielded bycutting the grooves 131 e along central lines thereof using the blades391, opposite end portions of the grooves 131 e are formed to be therecess 111 in the end portion of the glass sheet 131 of the imagingdevice 101. Furthermore, the black resin 371 is left as the grooves 131e in the recess 111, thereby forming the black resin section 321 in FIG.8.

Thus, of the glass sheet 31, a range excluding the recess 111 is formedas the surface F101 including the film formation region having the sameshape as the opening 161 of the tray 151. The recess 111 is abutted bythe claw 162 with the surface F101 being the film formation regionexposed from the opening 161 as illustrated in FIG. 8, allowing the ARfilm 141 being an inorganic film to be formed on the entirety of thesurface F101 being the film formation region.

Furthermore, the black resin section 321 (black resin 371) that spansside surfaces of the imaging device 101 is formed on the surface of therecess 111 as illustrated in a lowermost portion of the right part ofFIG. 9. Since the black resin section 321 absorbs incoming light andreflected light entering from the side surfaces, it is possible toreduce occurrence of ghost and flare.

5. FOURTH EMBODIMENT»

Through the above, an example of the imaging device 101 has beendescribed that reduces occurrence of ghost and flare by absorbing lightsuch as reflected light and multiply reflected light with the blackresin 371 (321) formed on the recess 111 to span the side surfaces ofthe imaging device 101. However, the black resin section may be formedon a surface of the tapered recess 111′ described with reference to FIG.5 to reduce occurrence of ghost and flare.

FIG. 10 illustrates a configuration example of a fourth embodiment ofthe imaging device 101 enabled to reduce occurrence of ghost and flaredue to reflected light and multiply reflected light by suppressing entryof light from the side surfaces with the black resin section or the likeformed on the surface of the recess 111′ of the glass sheet 131. Itshould be noted that constituent elements of the imaging device 101 inFIG. 10 that have the same functions as the constituent elements of theimaging device 101 in FIG. 5 are indicated by the same reference signsas in FIG. 5, and description thereof is omitted as appropriate.

That is, the imaging device 101 in FIG. 10 is different from the imagingdevice 101 in FIG. 5 in that a light-absorbing black resin section 411that spans the side surfaces of the imaging device 101 is formed on thesurface of the recess 111′.

Such a configuration enables the imaging device 101 to reduce occurrenceof ghost and flare, because the black resin section 411 absorbs incominglight and reflected light entering from directions of the side surfaces.

<Method of Producing Imaging Device in FIG. 10>

The following describes a method of producing the imaging device 101 inFIG. 10 with reference to FIG. 11.

In a first step, the sensor section 133 prior to singulation for theimaging device 101 is attached to the dicing sheet 181 with the glasssheet 131 facing upward as illustrated in an uppermost portion of a leftpart of FIG. 11.

In a second step, as illustrated in a second portion from the top of theleft part of FIG. 11, a location of a central line of each of V-shapedblades 421 is made to coincide with a location of a central line of acorresponding one of dicing lines for the singulated imaging device 101and a distance between inner surfaces of the V-shaped blades 421 is madeequal to the width of the film formation region. The blades 421 are thenused to form grooves 131 f (see a third portion from the top of the leftpart of FIG. 11) in the glass sheet 131.

In a third step, as illustrated in the third portion from the top of theleft part of FIG. 11, blades 431 having a smaller width than theV-shaped blades 421 are positioned such that a location of a centralline of each of the blades 431 coincides with the location of thecentral line of a corresponding one of the dicing lines for thesingulated imaging device 101. The blades 431 in such a state are thenused to cut the glass sheet 131, the resin layer 132, and the sensorsection 133 to form grooves 131 g (see a fourth portion from the top ofthe left part of FIG. 11).

In a fourth step, as illustrated in the fourth portion from the top ofthe left part of FIG. 11, the blades 431 are pulled out, forming grooves451, each of which is a combination of the groove 131 f and the groove131 g.

In a fifth step, as illustrated in a lowermost portion of the left partof FIG. 11, the grooves 451 are filled with a black resin 471.

In a sixth step, as illustrated in an uppermost portion of a right partof FIG. 11, the blades 421 are positioned such that the location of thecentral line of each of the blades 421 coincides with a location of acorresponding one of ends of the singulated imaging device 101. Theblades 421 in such a state are then used to form grooves 131 h (see asecond portion from the top of the right part of FIG. 11) having asmaller width and a smaller depth than the grooves 131 f in the blackresin 371.

In a seventh step, as illustrated in the second portion from the top ofthe right part of FIG. 11, blades 491 having a smaller width than theblades 431 are positioned such that a location of a central line of eachof the blades 491 coincides with the location of the central line of acorresponding one of the dicing lines for the singulated imaging device101. The blades 491 in such a state are then used to cut (dice) theglass sheet 131, the resin layer 132, the sensor section 133, and thedicing sheet 181.

In an eighth step, the blades 491 are pulled out, thereby yielding thesingulated imaging device 101 as illustrated in a third portion from thetop of the right part of FIG. 11.

That is, as a result of the singulated imaging device 101 being yieldedby cutting the grooves 131 h along central lines thereof using theblades 491, opposite end portions of the grooves 131 h are formed to bethe tapered recess 111′ in the end portion of the glass sheet 31 of theimaging device 101.

Furthermore, the black resin 471 is left as the grooves 131 h in therecess 111′, thereby forming a constituent element corresponding to theblack resin section 411 in FIG. 10.

Thus, of the glass sheet 31, a range excluding the recess 111′ is formedas the surface F101 including the film formation region. The surfaceF101 has substantially the same shape and substantially the same size asthe opening 161 of the tray 151. To be exact, the surface F101 isslightly smaller than the opening 161.

In a ninth step, the recess 111′ is abutted by the claw 162′ with thesurface F101 being the film formation region exposed from the opening161′ as illustrated in FIG. 10. The vapor deposition process isperformed from below in FIG. 10, and thus the AR film 141 being aninorganic film is able to be formed over the entirety of the surfaceF101 being the film formation region.

Furthermore, the black resin section 411 (471) that spans the sidesurfaces of the imaging device 101 is formed on the recess 111′ asillustrated in a lowermost portion of the right part of FIG. 11. Sincethe black resin section 411 absorbs incoming light and reflected lightentering from the side surfaces, it is possible to reduce occurrence ofghost and flare.

6. EXAMPLE OF APPLICATION TO ELECTRONIC APPARATUS»

The imaging device 101 in any of FIGS. 3, 5, 8, and 10 described aboveis applicable to various electronic apparatuses including, for example,imaging apparatuses such as digital still cameras and digital videocameras, mobile phones having an imaging function, and other apparatuseshaving an imaging function.

FIG. 12 is a block diagram illustrating a configuration example of animaging apparatus being an electronic apparatus to which the presenttechnology has been applied.

An imaging apparatus 501 illustrated in FIG. 12 includes an opticalsystem 502, a shutter 503, a solid-state imaging device 504, a drivecircuit 505, a signal processing circuit 506, a monitor 507, and memory508. The imaging apparatus 501 is able to capture still images andmoving images.

The optical system 502 includes one or more lenses and guides light froma subject (incident light) to the solid-state imaging device 504 toimage the light on a light receiving plane of the solid-state imagingdevice 504.

The shutter 503 is disposed between the optical system 502 and thesolid-state imaging device 504, and controls a light irradiation periodand a light blocking period for light to the solid-state imaging device504 in accordance with control of the drive circuit 1005.

The solid-state imaging device 504 is in a configuration of a packageincluding the above-described solid-state imaging device. Thesolid-state imaging device 504 accumulates signal charge for a specificperiod of time depending on light to be imaged on the light receivingplane through the optical system 502 and the shutter 503. The signalcharge accumulated by the solid-state imaging device 504 is transferredin accordance with a drive signal (timing signal) supplied from thedrive circuit 505.

The drive circuit 505 outputs drive signals that control the transferoperation of the solid-state imaging device 504 and a shutteringoperation of the shutter 503 to drive the solid-state imaging device 504and the shutter 503.

The signal processing circuit 506 performs various types of signalprocessing on the signal charge outputted from the solid-state imagingdevice 504. An image (image data) obtained through the signal processingby the signal processing circuit 506 is supplied to the monitor 507 tobe displayed thereon or supplied to the memory 508 to be stored(recorded) therein.

In the imaging apparatus 501 having such a configuration, the use of theimaging device 101 in any of FIGS. 3, 5, 8, and 10 instead of theoptical system 502 and the solid-state imaging device 504 describedabove enables formation of an inorganic film over the entirety of thefilm formation region of the glass sheet in the imaging device.Furthermore, the use of the imaging device 101 in any of FIGS. 8 and 10enables reduction of ghost and flare.

7. USAGE EXAMPLES OF IMAGING DEVICE»

FIG. 13 is a diagram illustrating usage examples of the above-describedimaging device 101.

The above-described imaging device 101 is for example usable in variouscases such as described below in which light such as visible light,infrared light, ultraviolet light, and X-rays is sensed.

Apparatuses, such as a digital camera and a mobile apparatus having acamera function, that capture images for viewing

Apparatuses for transportation applications, such as surveillancecameras that monitor running vehicles and roads, range-finding sensorsfor measuring a distance between vehicles or the like, and on-vehiclesensors that capture images of the view in front of, behind, around, orwithin a car for, for example, driver's condition recognition and safetydriving by automatic stop and the like

Apparatuses for home electrical appliances, such as TV, refrigerators,and air conditioners, for capturing images of user's gestures andoperating the appliances in accordance with the gestures

Apparatuses for medical care or healthcare applications, such asendoscopes and apparatuses that perform vascular imaging by receivinginfrared light

Apparatuses for security applications, such as surveillance cameras forcrime prevention and cameras for human authentication

Apparatuses for beauty care applications, such as skin measurementapparatuses that capture images of skin and microscopes that captureimages of scalp

Apparatuses for sports applications, such as action cameras and wearablecameras for usages in sports and the like

Apparatuses for agricultural applications, such as cameras formonitoring conditions of agricultural fields and agricultural plants

8. EXAMPLE OF APPLICATION TO ENDOSCOPIC SURGERY SYSTEM»

The technology according to the present disclosure (present technology)is applicable to various products. For example, the technology accordingto the present disclosure may be applied to an endoscopic surgerysystem.

FIG. 14 is a view depicting an example of a schematic configuration ofan endoscopic surgery system to which the technology according to anembodiment of the present disclosure (present technology) can beapplied.

In FIG. 14, a state is illustrated in which a surgeon (medical doctor)11131 is using an endoscopic surgery system 11000 to perform surgery fora patient 11132 on a patient bed 11133. As depicted, the endoscopicsurgery system 11000 includes an endoscope 11100, other surgical tools11110 such as a pneumoperitoneum tube 11111 and an energy device 11112,a supporting arm apparatus 11120 which supports the endoscope 11100thereon, and a cart 11200 on which various apparatus for endoscopicsurgery are mounted.

The endoscope 11100 includes a lens barrel 11101 having a region of apredetermined length from a distal end thereof to be inserted into abody cavity of the patient 11132, and a camera head 11102 connected to aproximal end of the lens barrel 11101. In the example depicted, theendoscope 11100 is depicted which includes as a rigid endoscope havingthe lens barrel 11101 of the hard type. However, the endoscope 11100 mayotherwise be included as a flexible endoscope having the lens barrel11101 of the flexible type.

The lens barrel 11101 has, at a distal end thereof, an opening in whichan objective lens is fitted. A light source apparatus 11203 is connectedto the endoscope 11100 such that light generated by the light sourceapparatus 11203 is introduced to a distal end of the lens barrel 11101by a light guide extending in the inside of the lens barrel 11101 and isirradiated toward an observation target in a body cavity of the patient11132 through the objective lens. It is to be noted that the endoscope11100 may be a forward-viewing endoscope or may be an oblique-viewingendoscope or a side-viewing endoscope.

An optical system and an image pickup element are provided in the insideof the camera head 11102 such that reflected light (observation light)from the observation target is condensed on the image pickup element bythe optical system. The observation light is photo-electricallyconverted by the image pickup element to generate an electric signalcorresponding to the observation light, namely, an image signalcorresponding to an observation image. The image signal is transmittedas RAW data to a CCU 11201.

The CCU 11201 includes a central processing unit (CPU), a graphicsprocessing unit (GPU) or the like and integrally controls operation ofthe endoscope 11100 and a display apparatus 11202. Further, the CCU11201 receives an image signal from the camera head 11102 and performs,for the image signal, various image processes for displaying an imagebased on the image signal such as, for example, a development process(demosaic process).

The display apparatus 11202 displays thereon an image based on an imagesignal, for which the image processes have been performed by the CCU11201, under the control of the CCU 11201.

The light source apparatus 11203 includes a light source such as, forexample, a light emitting diode (LED) and supplies irradiation lightupon imaging of a surgical region to the endoscope 11100.

An inputting apparatus 11204 is an input interface for the endoscopicsurgery system 11000. A user can perform inputting of various kinds ofinformation or instruction inputting to the endoscopic surgery system11000 through the inputting apparatus 11204. For example, the user wouldinput an instruction or a like to change an image pickup condition (typeof irradiation light, magnification, focal distance or the like) by theendoscope 11100.

A treatment tool controlling apparatus 11205 controls driving of theenergy device 11112 for cautery or incision of a tissue, sealing of ablood vessel or the like. A pneumoperitoneum apparatus 11206 feeds gasinto a body cavity of the patient 11132 through the pneumoperitoneumtube 11111 to inflate the body cavity in order to secure the field ofview of the endoscope 11100 and secure the working space for thesurgeon. A recorder 11207 is an apparatus capable of recording variouskinds of information relating to surgery. A printer 11208 is anapparatus capable of printing various kinds of information relating tosurgery in various forms such as a text, an image or a graph.

It is to be noted that the light source apparatus 11203 which suppliesirradiation light when a surgical region is to be imaged to theendoscope 11100 may include a white light source which includes, forexample, an LED, a laser light source or a combination of them. Where awhite light source includes a combination of red, green, and blue (RGB)laser light sources, since the output intensity and the output timingcan be controlled with a high degree of accuracy for each color (eachwavelength), adjustment of the white balance of a picked up image can beperformed by the light source apparatus 11203. Further, in this case, iflaser beams from the respective RGB laser light sources are irradiatedtime-divisionally on an observation target and driving of the imagepickup elements of the camera head 11102 are controlled in synchronismwith the irradiation timings. Then images individually corresponding tothe R, G and B colors can be also picked up time-divisionally. Accordingto this method, a color image can be obtained even if color filters arenot provided for the image pickup element.

Further, the light source apparatus 11203 may be controlled such thatthe intensity of light to be outputted is changed for each predeterminedtime. By controlling driving of the image pickup element of the camerahead 11102 in synchronism with the timing of the change of the intensityof light to acquire images time-divisionally and synthesizing theimages, an image of a high dynamic range free from underexposed blockedup shadows and overexposed highlights can be created.

Further, the light source apparatus 11203 may be configured to supplylight of a predetermined wavelength band ready for special lightobservation. In special light observation, for example, by utilizing thewavelength dependency of absorption of light in a body tissue toirradiate light of a narrow band in comparison with irradiation lightupon ordinary observation (namely, white light), narrow band observation(narrow band imaging) of imaging a predetermined tissue such as a bloodvessel of a superficial portion of the mucous membrane or the like in ahigh contrast is performed. Alternatively, in special light observation,fluorescent observation for obtaining an image from fluorescent lightgenerated by irradiation of excitation light may be performed. Influorescent observation, it is possible to perform observation offluorescent light from a body tissue by irradiating excitation light onthe body tissue (autofluorescence observation) or to obtain afluorescent light image by locally injecting a reagent such asindocyanine green (ICG) into a body tissue and irradiating excitationlight corresponding to a fluorescent light wavelength of the reagentupon the body tissue. The light source apparatus 11203 can be configuredto supply such narrow-band light and/or excitation light suitable forspecial light observation as described above.

FIG. 15 is a block diagram depicting an example of a functionalconfiguration of the camera head 11102 and the CCU 11201 depicted inFIG. 14.

The camera head 11102 includes a lens unit 11401, an image pickup unit11402, a driving unit 11403, a communication unit 11404 and a camerahead controlling unit 11405. The CCU 11201 includes a communication unit11411, an image processing unit 11412 and a control unit 11413. Thecamera head 11102 and the CCU 11201 are connected for communication toeach other by a transmission cable 11400.

The lens unit 11401 is an optical system, provided at a connectinglocation to the lens barrel 11101. Observation light taken in from adistal end of the lens barrel 11101 is guided to the camera head 11102and introduced into the lens unit 11401. The lens unit 11401 includes acombination of a plurality of lenses including a zoom lens and afocusing lens.

The number of image pickup elements which is included by the imagepickup unit 11402 may be one (single-plate type) or a plural number(multi-plate type). Where the image pickup unit 11402 is configured asthat of the multi-plate type, for example, image signals correspondingto respective R, G and B are generated by the image pickup elements, andthe image signals may be synthesized to obtain a color image. The imagepickup unit 11402 may also be configured so as to have a pair of imagepickup elements for acquiring respective image signals for the right eyeand the left eye ready for three dimensional (3D) display. If 3D displayis performed, then the depth of a living body tissue in a surgicalregion can be comprehended more accurately by the surgeon 11131. It isto be noted that, where the image pickup unit 11402 is configured asthat of stereoscopic type, a plurality of systems of lens units 11401are provided corresponding to the individual image pickup elements.

Further, the image pickup unit 11402 may not necessarily be provided onthe camera head 11102. For example, the image pickup unit 11402 may beprovided immediately behind the objective lens in the inside of the lensbarrel 11101.

The driving unit 11403 includes an actuator and moves the zoom lens andthe focusing lens of the lens unit 11401 by a predetermined distancealong an optical axis under the control of the camera head controllingunit 11405. Consequently, the magnification and the focal point of apicked up image by the image pickup unit 11402 can be adjusted suitably.

The communication unit 11404 includes a communication apparatus fortransmitting and receiving various kinds of information to and from theCCU 11201. The communication unit 11404 transmits an image signalacquired from the image pickup unit 11402 as RAW data to the CCU 11201through the transmission cable 11400.

In addition, the communication unit 11404 receives a control signal forcontrolling driving of the camera head 11102 from the CCU 11201 andsupplies the control signal to the camera head controlling unit 11405.The control signal includes information relating to image pickupconditions such as, for example, information that a frame rate of apicked up image is designated, information that an exposure value uponimage picking up is designated and/or information that a magnificationand a focal point of a picked up image are designated.

It is to be noted that the image pickup conditions such as the framerate, exposure value, magnification or focal point may be designated bythe user or may be set automatically by the control unit 11413 of theCCU 11201 on the basis of an acquired image signal. In the latter case,an auto exposure (AE) function, an auto focus (AF) function and an autowhite balance (AWB) function are incorporated in the endoscope 11100.

The camera head controlling unit 11405 controls driving of the camerahead 11102 on the basis of a control signal from the CCU 11201 receivedthrough the communication unit 11404.

The communication unit 11411 includes a communication apparatus fortransmitting and receiving various kinds of information to and from thecamera head 11102. The communication unit 11411 receives an image signaltransmitted thereto from the camera head 11102 through the transmissioncable 11400.

Further, the communication unit 11411 transmits a control signal forcontrolling driving of the camera head 11102 to the camera head 11102.The image signal and the control signal can be transmitted by electricalcommunication, optical communication or the like.

The image processing unit 11412 performs various image processes for animage signal in the form of RAW data transmitted thereto from the camerahead 11102. The control unit 11413 performs various kinds of controlrelating to image picking up of a surgical region or the like by theendoscope 11100 and display of a picked up image obtained by imagepicking up of the surgical region or the like. For example, the controlunit 11413 creates a control signal for controlling driving of thecamera head 11102.

Further, the control unit 11413 controls, on the basis of an imagesignal for which image processes have been performed by the imageprocessing unit 11412, the display apparatus 11202 to display a pickedup image in which the surgical region or the like is imaged. Thereupon,the control unit 11413 may recognize various objects in the picked upimage using various image recognition technologies. For example, thecontrol unit 11413 can recognize a surgical tool such as forceps, aparticular living body region, bleeding, mist when the energy device11112 is used and so forth by detecting the shape, color and so forth ofedges of objects included in a picked up image. The control unit 11413may cause, when it controls the display apparatus 11202 to display apicked up image, various kinds of surgery supporting information to bedisplayed in an overlapping manner with an image of the surgical regionusing a result of the recognition. Where surgery supporting informationis displayed in an overlapping manner and presented to the surgeon11131, the burden on the surgeon 11131 can be reduced and the surgeon11131 can proceed with the surgery with certainty.

The transmission cable 11400 which connects the camera head 11102 andthe CCU 11201 to each other is an electric signal cable ready forcommunication of an electric signal, an optical fiber ready for opticalcommunication or a composite cable ready for both of electrical andoptical communications.

Here, while, in the example depicted, communication is performed bywired communication using the transmission cable 11400, thecommunication between the camera head 11102 and the CCU 11201 may beperformed by wireless communication.

An example of an endoscopic surgery system to which the technologyaccording to the present disclosure is applicable has been describedabove. The technology according to the present disclosure is applicableto, for example, the endoscope 11100, (the image pickup unit 11402 of)the camera head 11102, (the image processing unit 11412 of) the CCU11201, or the like, out of the components described above. Specifically,for example, the imaging device 101 in any of FIGS. 3, 5, 8, and 10 isapplicable to the image pickup unit 10402. Applying the technologyaccording to the present disclosure to the image pickup unit 10402enables reliable formation of an inorganic film over the entirety of thefilm formation region of the glass sheet in the imaging device.Furthermore, apply the imaging device 101 in any of FIGS. 3, 5, 8, and10 enables reduction of ghost and flare.

Note that although the endoscopic surgery system has been described asan example here, the technology according to the present disclosure mayalso be applied to, for example, a microscopic surgery system or thelike.

9. EXAMPLE OF APPLICATION TO MOBILE BODY»

The technology according to the present disclosure (present technology)is applicable to various products. For example, the technology accordingto the present disclosure may be implemented as an apparatus mounted onany type of mobile body such as an automobile, an electric vehicle, ahybrid electric vehicle, a motorcycle, a bicycle, a personal mobility,an airplane, a drone, a vessel, or a robot.

FIG. 16 is a block diagram depicting an example of schematicconfiguration of a vehicle control system as an example of a mobile bodycontrol system to which the technology according to an embodiment of thepresent disclosure can be applied.

The vehicle control system 12000 includes a plurality of electroniccontrol units connected to each other via a communication network 12001.In the example depicted in FIG. 16, the vehicle control system 12000includes a driving system control unit 12010, a body system control unit12020, an outside-vehicle information detecting unit 12030, anin-vehicle information detecting unit 12040, and an integrated controlunit 12050. In addition, a microcomputer 12051, a sound/image outputsection 12052, and a vehicle-mounted network interface (I/F) 12053 areillustrated as a functional configuration of the integrated control unit12050.

The driving system control unit 12010 controls the operation of devicesrelated to the driving system of the vehicle in accordance with variouskinds of programs. For example, the driving system control unit 12010functions as a control device for a driving force generating device forgenerating the driving force of the vehicle, such as an internalcombustion engine, a driving motor, or the like, a driving forcetransmitting mechanism for transmitting the driving force to wheels, asteering mechanism for adjusting the steering angle of the vehicle, abraking device for generating the braking force of the vehicle, and thelike.

The body system control unit 12020 controls the operation of variouskinds of devices provided to a vehicle body in accordance with variouskinds of programs. For example, the body system control unit 12020functions as a control device for a keyless entry system, a smart keysystem, a power window device, or various kinds of lamps such as aheadlamp, a backup lamp, a brake lamp, a turn signal, a fog lamp, or thelike. In this case, radio waves transmitted from a mobile device as analternative to a key or signals of various kinds of switches can beinput to the body system control unit 12020. The body system controlunit 12020 receives these input radio waves or signals, and controls adoor lock device, the power window device, the lamps, or the like of thevehicle.

The outside-vehicle information detecting unit 12030 detects informationabout the outside of the vehicle including the vehicle control system12000. For example, the outside-vehicle information detecting unit 12030is connected with an imaging section 12031. The outside-vehicleinformation detecting unit 12030 makes the imaging section 12031 imagean image of the outside of the vehicle, and receives the imaged image.On the basis of the received image, the outside-vehicle informationdetecting unit 12030 may perform processing of detecting an object suchas a human, a vehicle, an obstacle, a sign, a character on a roadsurface, or the like, or processing of detecting a distance thereto.

The imaging section 12031 is an optical sensor that receives light, andwhich outputs an electric signal corresponding to a received lightamount of the light. The imaging section 12031 can output the electricsignal as an image, or can output the electric signal as informationabout a measured distance. In addition, the light received by theimaging section 12031 may be visible light, or may be invisible lightsuch as infrared rays or the like.

The in-vehicle information detecting unit 12040 detects informationabout the inside of the vehicle. The in-vehicle information detectingunit 12040 is, for example, connected with a driver state detectingsection 12041 that detects the state of a driver. The driver statedetecting section 12041, for example, includes a camera that images thedriver. On the basis of detection information input from the driverstate detecting section 12041, the in-vehicle information detecting unit12040 may calculate a degree of fatigue of the driver or a degree ofconcentration of the driver, or may determine whether the driver isdozing.

The microcomputer 12051 can calculate a control target value for thedriving force generating device, the steering mechanism, or the brakingdevice on the basis of the information about the inside or outside ofthe vehicle which information is obtained by the outside-vehicleinformation detecting unit 12030 or the in-vehicle information detectingunit 12040, and output a control command to the driving system controlunit 12010. For example, the microcomputer 12051 can perform cooperativecontrol intended to implement functions of an advanced driver assistancesystem (ADAS) which functions include collision avoidance or shockmitigation for the vehicle, following driving based on a followingdistance, vehicle speed maintaining driving, a warning of collision ofthe vehicle, a warning of deviation of the vehicle from a lane, or thelike.

In addition, the microcomputer 12051 can perform cooperative controlintended for automatic driving, which makes the vehicle to travelautonomously without depending on the operation of the driver, or thelike, by controlling the driving force generating device, the steeringmechanism, the braking device, or the like on the basis of theinformation about the outside or inside of the vehicle which informationis obtained by the outside-vehicle information detecting unit 12030 orthe in-vehicle information detecting unit 12040.

In addition, the microcomputer 12051 can output a control command to thebody system control unit 12020 on the basis of the information about theoutside of the vehicle which information is obtained by theoutside-vehicle information detecting unit 12030. For example, themicrocomputer 12051 can perform cooperative control intended to preventa glare by controlling the headlamp so as to change from a high beam toa low beam, for example, in accordance with the position of a precedingvehicle or an oncoming vehicle detected by the outside-vehicleinformation detecting unit 12030.

The sound/image output section 12052 transmits an output signal of atleast one of a sound and an image to an output device capable ofvisually or auditorily notifying information to an occupant of thevehicle or the outside of the vehicle. In the example of FIG. 16, anaudio speaker 12061, a display section 12062, and an instrument panel12063 are illustrated as the output device. The display section 12062may, for example, include at least one of an on-board display and ahead-up display.

FIG. 17 is a diagram depicting an example of the installation positionof the imaging section 12031.

In FIG. 17, the imaging section 12031 includes imaging sections 12101,12102, 12103, 12104, and 12105.

The imaging sections 12101, 12102, 12103, 12104, and 12105 are, forexample, disposed at positions on a front nose, sideview mirrors, a rearbumper, and a back door of the vehicle 12100 as well as a position on anupper portion of a windshield within the interior of the vehicle. Theimaging section 12101 provided to the front nose and the imaging section12105 provided to the upper portion of the windshield within theinterior of the vehicle obtain mainly an image of the front of thevehicle 12100. The imaging sections 12102 and 12103 provided to thesideview mirrors obtain mainly an image of the sides of the vehicle12100. The imaging section 12104 provided to the rear bumper or the backdoor obtains mainly an image of the rear of the vehicle 12100. Theimaging section 12105 provided to the upper portion of the windshieldwithin the interior of the vehicle is used mainly to detect a precedingvehicle, a pedestrian, an obstacle, a signal, a traffic sign, a lane, orthe like.

Incidentally, FIG. 17 depicts an example of photographing ranges of theimaging sections 12101 to 12104. An imaging range 12111 represents theimaging range of the imaging section 12101 provided to the front nose.Imaging ranges 12112 and 12113 respectively represent the imaging rangesof the imaging sections 12102 and 12103 provided to the sideviewmirrors. An imaging range 12114 represents the imaging range of theimaging section 12104 provided to the rear bumper or the back door. Abird's-eye image of the vehicle 12100 as viewed from above is obtainedby superimposing image data imaged by the imaging sections 12101 to12104, for example.

At least one of the imaging sections 12101 to 12104 may have a functionof obtaining distance information. For example, at least one of theimaging sections 12101 to 12104 may be a stereo camera constituted of aplurality of imaging elements, or may be an imaging element havingpixels for phase difference detection.

For example, the microcomputer 12051 can determine a distance to eachthree-dimensional object within the imaging ranges 12111 to 12114 and atemporal change in the distance (relative speed with respect to thevehicle 12100) on the basis of the distance information obtained fromthe imaging sections 12101 to 12104, and thereby extract, as a precedingvehicle, a nearest three-dimensional object in particular that ispresent on a traveling path of the vehicle 12100 and which travels insubstantially the same direction as the vehicle 12100 at a predeterminedspeed (for example, equal to or more than 0 km/hour). Further, themicrocomputer 12051 can set a following distance to be maintained infront of a preceding vehicle in advance, and perform automatic brakecontrol (including following stop control), automatic accelerationcontrol (including following start control), or the like. It is thuspossible to perform cooperative control intended for automatic drivingthat makes the vehicle travel autonomously without depending on theoperation of the driver or the like.

For example, the microcomputer 12051 can classify three-dimensionalobject data on three-dimensional objects into three-dimensional objectdata of a two-wheeled vehicle, a standard-sized vehicle, a large-sizedvehicle, a pedestrian, a utility pole, and other three-dimensionalobjects on the basis of the distance information obtained from theimaging sections 12101 to 12104, extract the classifiedthree-dimensional object data, and use the extracted three-dimensionalobject data for automatic avoidance of an obstacle. For example, themicrocomputer 12051 identifies obstacles around the vehicle 12100 asobstacles that the driver of the vehicle 12100 can recognize visuallyand obstacles that are difficult for the driver of the vehicle 12100 torecognize visually. Then, the microcomputer 12051 determines a collisionrisk indicating a risk of collision with each obstacle. In a situationin which the collision risk is equal to or higher than a set value andthere is thus a possibility of collision, the microcomputer 12051outputs a warning to the driver via the audio speaker 12061 or thedisplay section 12062, and performs forced deceleration or avoidancesteering via the driving system control unit 12010. The microcomputer12051 can thereby assist in driving to avoid collision.

At least one of the imaging sections 12101 to 12104 may be an infraredcamera that detects infrared rays. The microcomputer 12051 can, forexample, recognize a pedestrian by determining whether or not there is apedestrian in imaged images of the imaging sections 12101 to 12104. Suchrecognition of a pedestrian is, for example, performed by a procedure ofextracting characteristic points in the imaged images of the imagingsections 12101 to 12104 as infrared cameras and a procedure ofdetermining whether or not it is the pedestrian by performing patternmatching processing on a series of characteristic points representingthe contour of the object. When the microcomputer 12051 determines thatthere is a pedestrian in the imaged images of the imaging sections 12101to 12104, and thus recognizes the pedestrian, the sound/image outputsection 12052 controls the display section 12062 so that a squarecontour line for emphasis is displayed so as to be superimposed on therecognized pedestrian. The sound/image output section 12052 may alsocontrol the display section 12062 so that an icon or the likerepresenting the pedestrian is displayed at a desired position.

An example of a vehicle control system to which the technology accordingto the present disclosure is applicable has been described above. Thetechnology according to the present disclosure is applicable to theimaging section 12031, for example, among the above-describedcomponents. Specifically, for example, the imaging device 101 in any ofFIGS. 3, 5, 8, and 10 is applicable to the imaging section 12031.Applying the technology according to the present disclosure to theimaging section 12031 enables reliable formation of an inorganic filmover the entirety of the film formation region of the glass sheet in theimaging device. Furthermore, applying the imaging device 101 in any ofFIGS. 3, 5, 8, and 10 to the imaging section 12031 enables reduction ofghost and flare.

10. CONFIGURATION EXAMPLES OF STACKED SOLID-STATE IMAGING APPARATUS TOWHICH TECHNIQUE ACCORDING TO PRESENT DISCLOSURE IS APPLICABLE»

FIGS. 18A and 18B are diagrams illustrating an overview of configurationexamples of a stacked solid-state imaging apparatus to which thetechnique according to the present disclosure is applicable.

FIG. 18A illustrates an example of a schematic configuration of anon-stacked solid-state imaging apparatus. A solid-state imagingapparatus 23010 includes a single die (semiconductor substrate) 23011 asillustrated in FIG. 18A. A pixel region 23012 including arrayed pixels,a control circuit 23013 that drives the pixels and performs variousother types of control, and a logic circuit 23014 for signal processingare mounted in the die 23011.

FIGS. 18B and 18C illustrate examples of a schematic configuration of astacked solid-state imaging apparatus. As illustrated in FIGS. 18B and18C, a solid-state imaging apparatus 23020 includes two stacked dies, asensor die 23021 and a logic die 23024, electrically coupled to eachother and forming a single semiconductor chip.

In FIG. 18B, a pixel region 23012 and a control circuit 23013 aremounted in the sensor die 23021, and a logic circuit 23014 including asignal processing circuit that performs signal processing is mounted inthe logic die 23024.

In FIG. 18C, the pixel region 23012 is mounted in the sensor die 23021,and the control circuit 23013 and the logic circuit 23014 are mounted inthe logic die 23024.

FIG. 19 is a cross-sectional view illustrating a first configurationexample of the stacked solid-state imaging apparatus 23020.

PD (photodiode) forming pixels that constitute the pixel region 23012,FD (floating diffusion), Tr (MOSFET), Tr that constitutes the controlcircuit 23013, and the like are formed in the sensor die 23021.Furthermore, a wiring layer 23101 including a plurality of layers, whichin this example is three layers, of wiring lines 23110 is formed in thesensor die 23021. It should be noted that the control circuit 23013 (Trthat constitutes the control circuit 23013) may be included in the logicdie 23024 instead of the sensor die 23021.

Tr that constitutes the logic circuit 23014 is formed in the logic die23024. Furthermore, a wiring layer 23161 including a plurality oflayers, which in this example is three layers, of wiring lines 23170 isformed in the logic die 23024. A contact hole 23171 having an insulatingfilm 23172 formed on an inner wall surface thereof is formed in thelogic die 23024, and a connection conductor 23173 to be coupled to thewiring lines 23170 and the like is embedded in the contact hole 23171.

The sensor die 23021 and the logic die 23024 are bonded together withtheir wiring layers 23101 and 23161 facing toward each other, formingthe stacked solid-state imaging apparatus 23020 in which the sensor die23021 and the logic die 23024 are stacked. A film 23191 such as aprotective film is formed on a bonding plane between the sensor die23021 and the logic die 23024.

A contact hole 23111 is formed in the sensor die 23021. The contact hole23111 penetrates the sensor die 23021 from a back surface side (sidewhere light enters the PD) (upper side) of the sensor die 23021 andreaches the uppermost layer of wiring line 23170 of the logic die 23024.Furthermore, a contact hole 23121 is formed in the sensor die 23021. Thecontact hole 23121 is located close to the contact hole 23111 andreaches the first layer of wiring line 23110 from the back surface sideof the sensor die 23021. An insulating film 23112 is formed on an innerwall surface of the contact hole 23111, and an insulating film 23122 isformed on an inner wall surface of the contact hole 23121. Connectionconductors 23113 and 23123 are respectively embedded in the contactholes 23111 and 23121. The connection conductors 23113 and 23123 areelectrically coupled together on the back surface side of the sensor die23021, and thus the sensor die 23021 and the logic die 23024 areelectrically coupled together via the wiring layer 23101, the contacthole 23121, the contact hole 23111, and the wiring layer 23161.

FIG. 20 is a cross-sectional view illustrating a second configurationexample of the stacked solid-state imaging apparatus 23020.

According to the second configuration example of the solid-state imagingapparatus 23020, a single contact hole 23211 formed in the sensor die23021 electrically couples the sensor die 23021 (the wiring layer 23101of the sensor die 23021 (the wiring lines 23110 of the wiring layer23101)) and the logic die 23024 (the wiring layer 23161 of the logic die23024 (the wiring lines 23170 of the wiring layer 23161)) together.

That is, the contact hole 23211 in FIG. 20 penetrates the sensor die23021 from the back surface side of the sensor die 23021 and reaches theuppermost layer of wiring line 23170 of the logic die 23024 and alsoreaches the uppermost layer of wiring line 23110 of the sensor die23021. An insulating film 23212 is formed on an inner wall surface ofthe contact hole 23211, and a connection conductor 23213 is embedded inthe contact hole 23211. While the sensor die 23021 and the logic die23024 in FIG. 19 described above are electrically coupled together bythe two contact holes 23111 and 23121, the sensor die 23021 and thelogic die 23024 in FIG. 20 are electrically coupled together by thesingle contact hole 23211.

FIG. 21 is a cross-sectional view illustrating a third configurationexample of the stacked solid-state imaging apparatus 23020.

The solid-state imaging apparatus 23020 in FIG. 21 is different from thesolid-state imaging apparatus 23020 in FIG. 19 in that the former doesnot have the film 23191 such as a protective film formed on the bondingplane between the sensor die 23021 and the logic die 23024 but thelatter has the film 23191 such as a protective film formed on thebonding plane between the sensor die 23021 and the logic die 23024.

The solid-state imaging apparatus 23020 in FIG. 21 is formed by stackingthe sensor die 23021 and the logic die 23024 such that the wiring lines23110 and 23170 are in direct contact with each other, and applyingdesired load and heat thereto to directly bond the wiring lines 23110and 23170 together.

FIG. 22 is a cross-sectional view illustrating another configurationexample of the stacked solid-state imaging apparatus to which thetechnique according to the present disclosure is applicable.

A solid-state imaging apparatus 23401 in FIG. 22 has a three-layerstacked structure including three stacked dies: a sensor die 23411, alogic die 23412, and a memory die 23413.

The memory die 23413 for example includes a memory circuit that performsstorage of data temporarily necessary in signal processing beingperformed in the logic die 23412.

In FIG. 22, the logic die 23412 and the memory die 23413 are arrangedunder the sensor die 23411 into a stack in the stated order, but thelogic die 23412 and the memory die 23413 may be arranged under thesensor die 23411 into a stack in the inverse order, which in other wordsis an order of the memory die 23413 and the logic die 23412.

It should be noted that PD constituting a photoelectric conversionsection of each pixel and source/drain regions of each pixel Tr areformed in the sensor die 23411 in FIG. 22.

A gate electrode is formed around the PD with a gate insulatortherebetween, and the gate electrode and the paired source/drain regionsform each of a pixel Tr 23421 and a pixel Tr 23422.

The pixel Tr 23421 adjacent to the PD is transfer Tr, and one of thepaired source/drain regions forming the pixel Tr 23421 constitutes FD.

Furthermore, an inter-layer insulating film is formed in the sensor die23411, and contact holes are formed in the inter-layer insulating film.Connection conductors 23431 are formed in the respective contact holesand coupled to the pixel Tr 23421 and the pixel Tr 23422.

Furthermore, a wiring layer 23433 including a plurality of layers ofwiring lines 23432 coupled to each of the connection conductors 23431 isformed in the sensor die 23411.

Furthermore, an aluminum pad 23434 that serves as an electrode forexternal connection is formed in the lowermost layer of the wiring layer23433 in the sensor die 23411. That is, the aluminum pad 23434 in thesensor die 23411 is located closer to a bonding plane 23440 between thesensor die 23411 and the logic die 23412 than the wiring lines 23432.The aluminum pad 23434 is used as one end of a wiring line for input andoutput of signals to and from the outside.

Furthermore, in the sensor die 23411, a contact 23441 is formed, whichis used for electrical coupling of the sensor die 23411 to the logic die23412. The contact 23441 is coupled to a contact 23451 in the logic die23412 and is also coupled to an aluminum pad 23442 in the sensor die23411.

Furthermore, in the sensor die 23411, a pad hole 23443 is formed, whichreaches the aluminum pad 23442 from a back surface side (upper side) ofthe sensor die 23411.

The technique according to the present disclosure is applicable tosolid-state imaging apparatuses such as described above.

It should be noted that the present disclosure may have the followingconfigurations.

<1>

An imaging device including:

an image sensor that captures an image; and

a glass sheet disposed on the image sensor, the glass sheet having aperipheral portion provided with a recess.

<2>

The imaging device according to <1>, in which the peripheral portionprovided with the recess is located outside a film formation region ofthe glass sheet, the film formation region being a region over which aninorganic film is to be formed.

<3>

The imaging device according to <1> or <2>, in which the recess is in ashape corresponding to a claw on a periphery of an opening provided in atray for formation of an inorganic film on the glass sheet.

<4>

The imaging device according to any one of <1> to <3>, in which therecess is in a step-like shape.

<5>

The imaging device according to any one of <1> to <3>, in which therecess is tapered and is in a flat surface shape.

<6>

The imaging device according to any one of <1> to <3>, in which therecess is in a curved surface shape.

<7>

The imaging device according to any one of <1> to <6>, in which therecess has a surface provided with a light-absorbing black resinsection.

<8>

The imaging device according to any one of <1> to <7>, in which aninorganic film is formed on the glass sheet.

<9>

The imaging device according to <8>, in which the inorganic film is anAR (Anti Reflection) film or an IRCF (Infra-Red Cut Filter) film.

<10>

An imaging apparatus including:

an image sensor that captures an image; and

a glass sheet disposed on the image sensor, the glass sheet having aperipheral portion provided with a recess.

<11>

An electronic apparatus including:

an image sensor that captures an image; and

a glass sheet disposed on the image sensor, the glass sheet having aperipheral portion provided with a recess.

<12>

A method of producing an imaging device,

the imaging device including

an image sensor that captures an image, and

a glass sheet disposed on the image sensor, the glass sheet having aperipheral portion provided with a recess,

the method including:

a first step of forming first grooves in an undiced imaging device alongcentral lines of dicing lines using first blades having a predeterminedwidth; and

a second step of dicing the undiced imaging device along the centrallines of the dicing lines using second blades having a width smallerthan the predetermined width.

<13>

The method of producing the imaging device according to <12>, in whichthe first blades are V-shaped blades.

<14>

The method of producing the imaging device according to <12>, furtherincluding:

a third step of forming second grooves in the undiced imaging devicealong the central lines of the dicing lines using third blades after thefirst step, the second grooves having a larger depth than the firstgrooves, the third blades having a width smaller than the predeterminedwidth of the first blades and larger than the width of the secondblades; a fourth step of filling the second grooves with a black resin;and

a fifth step of forming third grooves in the undiced imaging devicealong the central lines of the dicing lines using fourth blades, thethird grooves having a smaller depth than the first grooves, the fourthblades having a width smaller than the width of the first blades andlarger than the width of the third blades, in which

after the fifth step, the second step is performed to dice the undicedimaging device along the central lines of the dicing lines using thesecond blades.

<15>

The method of producing the imaging device according to <14>, in whichthe first blades and the fourth blades are same V-shaped blades, and thefirst blades and the fourth blades are different in depth of grooves toform.

<16>

The method of producing the imaging device according to <14>, furtherincluding a sixth step of forming an inorganic film on the glass sheetafter the second step.

<17>

The method of producing the imaging device according to <16>, in whichthe inorganic film is an AR (Anti Reflection) film or an IRCF (Infra-RedCut Filter) film.

REFERENCE SIGNS LIST

-   101: Imaging device-   111: Recess-   111′: Recess-   131: Glass sheet-   131 a to 131 h: Groove-   132: Resin layer-   133: Sensor section-   141: AR Film-   151: Tray-   161: Opening-   162, 162′: Claw-   181: Dicing sheet-   201, 211, 231, 241: Blade-   321: Black resin section-   331, 341, 351: Blade-   371: Black resin-   381, 391: Blade-   411: Black resin section-   421: V-shaped blade-   431: Blade-   451: Groove-   471: Black resin-   491: Blade

1. An imaging device, comprising: a semiconductor substrate thatincludes a plurality of photodiodes; a glass sheet on the semiconductorsubstrate, wherein the glass sheet includes: a film formation region;and a peripheral portion outside the film formation region, and theperipheral portion includes a recess; and an inorganic film on therecess and the film formation region.
 2. The imaging device according toclaim 1, wherein a shape of the recess corresponds to a claw on aperiphery of an opening in a tray for formation of the inorganic film onthe glass sheet.
 3. The imaging device according to claim 1, wherein therecess has a step-like shape.
 4. The imaging device according to claim1, wherein the recess is tapered and has a flat surface.
 5. The imagingdevice according to claim 1, wherein the recess has a curved surface. 6.The imaging device according to claim 1, wherein the inorganic film ison the glass sheet.
 7. The imaging device according to claim 6, whereinthe inorganic film is one of an AR (Anti Reflection) film or an IRCF(Infra-Red Cut Filter) film.
 8. An imaging apparatus, comprising: asemiconductor substrate that includes a plurality of photodiodes; aglass sheet on the semiconductor substrate, wherein the glass sheetincludes: a film formation region; and a peripheral portion outside thefilm formation region, and the peripheral portion includes a recess; andan inorganic film on the recess and the film formation region.
 9. Anelectronic apparatus, comprising: a semiconductor substrate thatincludes a plurality of photodiodes; a glass sheet on the semiconductorsubstrate, wherein the glass sheet includes: a film formation region;and a peripheral portion outside the film formation region, and theperipheral portion includes a recess; and an inorganic film on therecess and the film formation region.
 10. A method of producing animaging device, the method comprising: attaching a semiconductorsubstrate with an undiced glass sheet to a dicing sheet; forming firstgrooves in the undiced glass sheet along central lines of dicing linesusing first blades having a specific width; dicing the undiced glasssheet along the central lines of the dicing lines using second bladeshaving a width smaller than the specific width, wherein the undicedglass sheet includes: a film formation region; and a peripheral portionoutside the film formation region, and the peripheral portion includes arecess; and forming an inorganic film on the recess and the filmformation region.
 11. The method of producing the imaging deviceaccording to claim 10, wherein the first blades are V-shaped blades. 12.The method of producing the imaging device according to claim 10,further comprising: forming second grooves in the undiced glass sheetalong the central lines of the dicing lines using third blades, whereinthe second grooves has a larger depth than the first grooves, and thethird blades has a width smaller than the specific width of the firstblades and larger than the width of the second blades; and forming thirdgrooves in the undiced glass sheet along the central lines of the dicinglines using fourth blades, wherein the third grooves has a smaller depththan the first grooves, and the fourth blades has a width smaller thanthe width of the first blades and larger than the width of the thirdblades; and dicing the undiced glass sheet along the central lines ofthe dicing lines using the second blades.
 13. The method of producingthe imaging device according to claim 12, wherein the first blades andthe fourth blades are same V-shaped blades, and the first blades and thefourth blades are different in depth of grooves to form.
 14. The methodof producing the imaging device according to claim 10, wherein theinorganic film is one of an AR (Anti Reflection) film or an IRCF(Infra-Red Cut Filter) film.